Standard Rigid PCB Capabilities

Standard Rigid PCB Capabilities

Features Capability
Layers 1-32 layers
Material FR4 standard Tg 140C, FR4 high Tg 170C
Board Thickness .016″-.126″(0.4mm-3.2mm)
Copper Thickness 1/2oz-6oz(18um-210um)
Inner layer Copper Thickness 0.5oz-2oz(18um-70um)
Board size 600x700mm
Min Tracing/Spacing 3mil/3mil
Min Annular Ring 3mil
Min drilling Hole diameter 0.15mm(6mil), 0.1mm(4mil)-laser drill
Min width of cutout (NPTH) 0.8mm
Min width of slot hole (PTH) 0.6mm
Solder Mask LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue)
Silkscreen color White, Blue, Black, Red, Yellow
Surface finish HASL -Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG -Electroless Nickle/Immersion Gold – RoHS(Thick of Au 1-3 u”)
ENIG -Electroless Nickle/Immersion Gold – RoHS(Thick of Au 3-5 u”)
ENIG -Electroless Nickle/Immersion Gold – RoHS(Thick of Au >5 u”)Immersion Silver – RoHS
Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS
Surface/Hole plating thickness 20-30um
Board thickness tolerance +/-0.1mm ~ +/-10%
Board size tolerance +/-0.1mm~+/-0.3mm
PTH hole size tolerance +/-.003″(+/-0.08mm)~+/-.006″(+/-0.15mm)
NPTH hole size tolerance +/-.002″(+/-0.05mm)
Copper thickness tolerance +0um+20um
SM tolerance(LPI) .003″(0.075mm)
Impedance tolerance +/-5%~+/-10%
SMD Pitch 0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Aspect Ratio(hole size: board thickness) 1:10
Chamfer of Gold Fingers 20, 30, 45, 60
Test 10V-250V, flying probe or testing fixture
Others Techniques Gold fingers
Blind/Buried hole
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cutted/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Last update time: January 4th , 2016

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